Opto-electric bus module and method of manufacturing the same

ABSTRACT

Provided are an opto-electric bus module and a method of manufacturing the opto-electric bus module. The opto-electric bus module includes an opto-electric interconnection unit where a concave-shaped micro structure is formed on a lower surface of a polymer structure and an optical bench where a convex-shaped micro structure is formed in a position corresponding to the concave-shaped micro structure, at least one second electric interconnection for electric connection with a semiconductor chip is formed, and the semiconductor chip and an opto-electric device can be mounted. Thus, automatic, efficient, high-speed, and high-integration optical communication and electric communication between multi-chips can be completed at the same time by using the opto-bus module which provides low-speed electric communication while manually maintaining solid optical coupling.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of Korean Patent Application No.10-2007-0026190, filed on Mar. 16, 2007, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to an opto-electric bus moduleand a method of manufacturing the same, and more particularly, to anopto-electric bus module which simultaneously provides opticalcommunication and electric communication between semiconductor chips,and a method of manufacturing the opto-electric bus module.

This work was supported by IT R&D program of MIC/IITA[2006-S-073-01,Nano flexible opto-electric PCB module for portable display].

2. Description of the Related Art

The development of technologies for semiconductor devices embedded inportable information communication devices requires informationtransmission techniques for transmitting mass information to monitors,hard disks, memories, and the like at high speeds.

Moreover, recent potable terminals such as cellular phones requiretechniques for high-speed interconnection between semiconductor chips inorder to process still image and moving image information as well asconventional voice information at high speeds.

With advances in technologies, there have emerged opticalinterconnection techniques capable of overcoming limitations, such assignal integrity, crosstalk, and electromagnetic interference (EMI) ofconventional electric conducting wires, for high-speed interconnectionbetween semiconductor chips and there have been developed opticalcommunication structures and methods between semiconductor chips byusing various optical connectors.

However, traditional parallel optical interconnection techniques usingoptical connectors require removable optical connectors techniques inwhich sophisticated and solid optical coupling between an opto-electricdevice (light emitting device or light receiving device) and an opticalfiber can be freely established and can then be released if necessary.

The removable optical connectors are highly likely to undergo twist ofoptical alignment between an opto-electric device and an optical fiberdue to repetitive removal, resulting in degradation of optical couplingefficiency.

Moreover, the degradation of optical coupling efficiency may cause aloss of continuously transmitted information or a problem intransmission.

Although solid optical connectors for sophisticated and solid opticalalignment between an opto-electric device and an optical fiber have beendeveloped, they increase the overall size of the optical connectors.Such a size increase may cause the inappropriate use of the space of theentire optical communication module and system using the opticalconnectors.

Recently, communication between semiconductor chips requiresconventional low-speed electric communication as well as conventionalhigh-speed optical communication, and electric communication betweensemiconductor chips using conventional printed circuit boards (PCBs)cannot guarantee sufficient miniaturization because the thickness andspace of the PCBs have to be considered in order to respond totransmission length increase and semiconductor chip miniaturization.

SUMMARY OF THE INVENTION

The present invention provides an opto-electric bus module which issimple and solid and simultaneously provides optical communication andelectric communication between semiconductor chips and a method ofmanufacturing the opto-electric bus module.

According to an aspect of the present invention, there is provided anopto-electric bus module including an opto-electric interconnection unitwhere an optical waveguide is formed and at least one of aconcave-shaped micro structure and a convex-shaped micro structure isformed on a lower surface of a structure into which at least one firstelectric interconnection line is inserted, and an optical bench where aconvex-shaped micro structure or a concave-shaped micro structure isformed in a position corresponding to the micro structure formed in theopto-electric interconnection unit, an opto-electric device forperforming optical communication through the optical waveguide ismounted, and at least one second electric interconnection for electricconnection to a semiconductor chip is formed.

According to another aspect of the present invention, there is provideda method of manufacturing an opto-electric interconnection unit. Themethod includes forming a lower clad by coating ultraviolet (UV)hardened polymer onto a substrate and hardening the substrate with UVrays, and forming an optical waveguide and an electric interconnectionon the resulting upper clad, forming an upper clad by coating UVhardened polymer onto the lower clad, pressing an UV permeable moldhaving a convex-shaped micro structure formed therein onto the upperclad, and hardening the resulting upper clad with UV rays, andseparating the mold from the upper clad.

According to another aspect of the present invention, there is provideda method of manufacturing an opto-electric interconnection unit. Themethod includes forming a lower clad by coating ultraviolet (UV)hardened polymer onto a substrate and hardening the substrate with UVrays, and forming an optical waveguide on the resulting upper clad,forming an upper clad by coating UV hardened polymer onto the lowerclad, pressing an UV permeable mold having a concave-shaped microstructure formed therein onto the upper clad, and hardening theresulting upper clad with UV rays, separating the mold from the upperclad, and forming an electric interconnection on the upper clad.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other features and advantages of the present inventionwill become more apparent by describing in detail embodiments thereofwith reference to the attached drawings in which:

FIG. 1 illustrates the structure of an opto-electric bus moduleaccording to an embodiment of the present invention;

FIGS. 2A through 2C illustrate in detail an opto-electric transmissionunit of the opto-electric bus module according to an embodiment of thepresent invention;

FIGS. 3A through 3E illustrate optical coupling and electric coupling ofthe opto-electric bus module according to another embodiment of thepresent invention;

FIGS. 4A and 4B illustrate examples for improving optical couplingefficiency of the opto-electric bus module according to anotherembodiment of the present invention;

FIG. 5 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention;

FIGS. 6A through 6D illustrate the structure of an opto-electric busmodule according to another embodiment of the present invention;

FIGS. 7A and 7B illustrate the structure of an opto-electric bus moduleaccording to another embodiment of the present invention;

FIGS. 8A and 8B illustrate the structure of an opto-electric bus moduleaccording to another embodiment of the present invention;

FIGS. 9A and 9B illustrate examples for improving the efficiency ofoptical coupling of an opto-electric bus module according to anotherembodiment of the present invention;

FIG. 10 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention;

FIGS. 11A and 11B illustrate optical coupling and electric coupling ofthe opto-electric bus module according to another embodiment of thepresent invention;

FIG. 12 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention;

FIGS. 13A through 13D illustrate optical coupling and electric couplingof the opto-electric bus module according to another embodiment of thepresent invention;

FIGS. 14A through 14C illustrate the structure of an opto-electric busmodule according to another embodiment of the present invention;

FIGS. 15A through 15D illustrate examples for improving the efficiencyof optical coupling of the opto-electric bus module according to anotherembodiment of the present invention;

FIG. 16 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention;

FIGS. 17A and 17B illustrate optical coupling and electric coupling ofthe opto-electric bus module according to another embodiment of thepresent invention;

FIGS. 18A through 18C are diagrams for explaining the structure of anoptical waveguide and the principle of optical transmission used in anoptical waveguide unit of an opto-electric bus module according to anembodiment of the present invention;

FIG. 19 illustrates a manually-connected opto-electric bus module and acommunication system providing opto-electric simultaneous communicationby using the manually-connected opto-electric bus module according to anembodiment of the present invention; and

FIGS. 20 and 21 are diagrams for explaining a method of manufacturing anopto-electric interconnection unit according to an embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. It should be notedthat like reference numerals refer to like elements illustrated in oneor more of the drawings. In the following description of the presentinvention, detailed description of known functions and configurationsincorporated herein will be omitted for conciseness and clarity.

FIG. 1 illustrates a structure of an opto-electric bus module accordingto an embodiment of the present invention.

Referring to FIG. 1, the opto-electric bus module includes anopto-electric transmission unit 100, an opto-electric reception unit200, and an opto-electric interconnection unit 300.

The opto-electric transmission unit 100 includes a printed circuit board(PCB) 101, an opto-electric device drive 102, an optical bench 103, anda light emitting device 104 formed on the optical bench 103. Aconvex-shaped micro structure is formed on a optical bench 103 and anelectric interconnection is formed on an upper surface of a portion ofthe convex-shaped micro structure and on the optical bench 103.

The opto-electric reception unit 200 includes a PCB 201, anopto-electric device amp 202, an optical bench 203, and a lightreceiving device 204 formed on the optical bench 203. A convex-shapedmicro structure is formed on the optical bench 203 and an electricinterconnection is formed on a lower surface of a portion of theconvex-shaped micro structure 206 and on the optical bench 203. In otherwords, the shapes of the opto-electric transmission unit 100 and theopto-electric reception unit 200 are symmetrical to each other.

The opto-electric interconnection unit 300 includes an optical waveguide301, an electric interconnection 302, and a concave-shaped microstructure 303. The electric interconnection 302 is formed open on thelower surface of a portion of the concave-shaped micro structure 303.

FIGS. 2A through 2C illustrate in detail the opto-electric transmissionunit 100 of the opto-electric bus module according to an embodiment ofthe present invention.

Referring to FIGS. 2A and 2B, the opto-electric interconnection unit 300may include the optical waveguide 301 inserted into a flexible polymerstructure, the electric interconnection 302, and the concave-shapedmicro structure 303. An end of the electric interconnection 302 isopened on the lower surface of the concave-shaped micro structure 303.

The opto-electric transmission unit 100 includes the opto-electricdevice drive 102 and the optical bench 103 mounted on the PCB 101. Anopto-electric device 104 and a large concave 105 are formed in theoptical bench 103. The convex-shaped micro structure 106 is formed onthe large concave 105 and the electric interconnection 107 formed on theconvex-shaped micro structure 106 extends to the upper surface of theoptical bench 103.

Three types of electric interconnections, i.e., the electricinterconnection 107 for electric communication, an electricinterconnection 108 for an optical device, and an integrated electricinterconnection 109 are formed.

The opto-electric device 104 is a light emitting device or a lightreceiving device. An end of the electric interconnection 107 extends tothe upper surface of the convex-shaped micro structure 106.

The concave-shaped micro structure 303 formed on the opto-electricinterconnection unit 300 is perpendicularly inserted into theconvex-shaped micro structure 106 formed on the optical bench 103 of theopto-electric transmission unit 100 by using flip-chip coupling, so thatthe opto-electric device 104 and the optical waveguide 301 areautomatically optical-coupled to each other vertically/horizontally.

At this time, since the electric interconnection 107 is formed on theupper surface of the portion of the convex-shaped micro structure 106 onthe optical bench 103 and the electric interconnection 302 is formed onthe lower surface of the portion of the concave-shaped micro structure303 of the opto-electric interconnection unit 300, two electricinterconnections 107, 302 are also automatically electric-coupled toeach other.

Referring to FIG. 2B, the concave-shaped micro structure 303 of theopto-electric interconnection unit 300 and the convex-shaped microstructure 106 on the optical bench 103 are formed in pyramid shape inorder to apply vertical flip-chip coupling to coupling between theconcave-shaped micro structure 303 and the convex-shaped micro structure106.

Referring to FIG. 2C, instead of applying vertical flip-chip coupling tocoupling between the concave-shaped micro structure 303 and theconvex-shaped micro structure 106 formed in pyramid shape as illustratedin FIG. 2B, the concave-shaped micro structure 303 of the opto-electricinterconnection unit 300 and the convex-shaped micro structure 106 onthe optical bench 103 may be formed in square pole in order to allow theopto-electric interconnection unit 300 to be coupled with the opticalbench 103 by sliding horizontally along the optical bench 103. Accordingto such a design, an optical alignment distance between the opticalwaveguide 301 and the opto-electric device 104 can be easily adjusted.

FIGS. 3A through 3E illustrate optical coupling and electric coupling ofthe opto-electric bus module according to another embodiment of thepresent invention.

In FIG. 3A, the opto-electric interconnection unit 300 and the opticalbench 103 of the opto-electric transmission unit 100 areopto-electric-coupled to each other. As described with reference toFIGS. 2A through 2C, the concave-shaped micro structure 303 of theopto-electric interconnection unit 300 is connected with theconvex-shaped micro structure 106 on the optical bench 103, therebysimultaneously forming optical alignment and electric connection.

FIGS. 3B and 3C illustrate a cross section taken along a line A-A′ ofFIG. 3A.

Referring to FIG. 3B, the concave-shaped micro structure 303 of theopto-electric interconnection unit 300 includes the concave-shaped microstructure 303 (hereinafter, referred to as a first concave-shaped microstructure) where the electric interconnection 302 is formed and aconcave-shaped micro structure 305 (hereinafter, referred to as a secondconcave-shaped micro structure) where the electric interconnection 302is not formed.

The convex-shaped micro structure 106 on the optical bench 103 of theopto-electric transmission unit 100 also includes the convex-shapedmicro structure 106 (hereinafter, referred to as a first convex-shapedmicro structure) where the electric interconnection 107 is formed and aconvex-shaped micro structure 111 (hereinafter, referred to as a secondconvex-shaped micro structure) where the electric interconnection 107 isnot formed.

The optical waveguide 301 may be formed between the first concave-shapedmicro structure 303 and the second concave-shaped micro structure 305 ofthe opto-electric interconnection unit 300.

A concave surface of the first concave-shaped micro structure 303 mayinclude the electric interconnection 302 and a space 306 for insertionof the electric interconnection 107 formed on a convex surface of thefirst convex-shaped micro structure 106. The horizontal positions of theoptical waveguide 301 and the electric interconnection 302 may be thesame or not the same as each other.

Referring to FIG. 3C, the first concave-shaped micro structure 303 isconnected to the first convex-shaped micro structure 106 and the secondconcave-shaped micro structure 305 is connected to the secondconvex-shaped micro structure 111.

The second concave-shaped micro structure 305 formed on theopto-electric interconnection unit 300 and the second convex-shapedmicro structure 111 formed on the optical bench 103 of the opto-electrictransmission unit 100 are coupled to each other, thereby completingautomatic, vertical and horizontal optical alignments between theopto-electric device 104 and the optical waveguide 301.

Moreover, the electric interconnection 107 formed on the convex surfaceof the first convex-shaped micro structure 106 on the optical bench 103and the electric interconnection 302 formed on the concave surface ofthe first concave-shaped micro structure 303 are electrically connectedto each other, thereby simultaneously completing optical coupling andelectric connection between the opto-electric interconnection unit 300and the opto-electric transmission unit 100.

The second concave-shaped micro structure 305 and the secondconvex-shaped micro structure 111 are used for vertical and horizontaloptical alignment between the optical waveguide unit 301 of theopto-electric interconnection unit 300 and the opto-electric device 104.

By adjusting the heights of the second convex-shaped micro structure 111and the second concave-shaped micro structure 305, the height of theoptical waveguide unit 301 of the opto-electric interconnection unit 300placed on the optical bench 103 can be adjusted. Moreover, by adjustingthe positions of the second concave-shaped micro structure 305 and thesecond convex-shaped micro structure 111, the horizontal position of theoptical waveguide unit 301 of the opto-electric interconnection unit 300placed on the optical bench 103 can be adjusted.

Coupling between the first concave-shaped micro structure 303 and thefirst convex-shaped micro structure 106 forms electric connectionbetween the electric interconnection 302 formed on the concave surfaceand the electric interconnection 107 formed on the convex surface.

The electric interconnection 107 formed on the first convex-shaped microstructure 106 has some thickness. Thus, a step between the opticalwaveguide 301 and the opto-electric device 104 may be changed duringcoupling between the opto-electric interconnection unit 300 and theoptical bench 103. To prevent such a change, the first concave-shapedmicro structure 303 includes the space 306 into which the electricinterconnection 107 of the first convex-shaped micro structure 106 isinserted.

In other words, when the opto-electric interconnection unit 300 iscoupled to the optical bench 103, the space 306 accommodates theelectric interconnection 107, thereby maintaining the step between theoptical waveguide 301 and the opto-electric device 104, which is formedduring coupling between the second concave-shaped micro structure 304and the second convex-shaped micro structure 111, constant and thuspreventing change of optical coupling efficiency.

Moreover, the opto-electric interconnection unit 300 includes twolayers, i.e., an upper clad 304-2 and a lower clad 304-1. The concavesurface of the second concave-shaped micro structure 305 where theelectric interconnection 302 is not formed is located in a surface wherethe two clad layers meet. Micro structures corresponding to microstructures formed in the upper clad 304-2 of the opto-electricinterconnection unit 300 are formed in the optical bench 103.

FIGS. 3D through 3F illustrate a cross-section taken along a line B-B′of FIG. 3A.

Referring to FIGS. 3D through 3F, the first concave-shaped microstructure 303 formed on the opto-electric interconnection unit 300 isinserted into the first convex-shaped micro structure 106 of the opticalbench 103 of the opto-electric transmission unit 100, thereby completingautomatic, vertical optical-coupling between an active region 110 of theopto-electric device 104 and the optical waveguide 301.

During optical coupling, the electric interconnection 107 formed on aconvex surface of the first convex-shaped micro structure 106 of theoptical bench 103 and the electric interconnection 302 formed on aconcave surface of the first concave-shaped micro structure 303 of theopto-electric interconnection unit 300 are connected to each other.

Referring to FIG. 3F, an optical signal 1000 generated by theopto-electric device 104 is directly delivered to the optical waveguide301 formed on the opto-electric interconnection unit 300 in order totravel towards the opto-electric reception unit 200 of FIG. 1.

An electric signal 2000 generated by a semiconductor chip of theopto-electric transmission unit 100 is delivered to the electricinterconnection 107 of the first convex-shaped micro structure 106 andthen continues traveling along the electric interconnection 302 formedin the first concave-shaped micro structure 303 towards theopto-electric reception unit 200 of FIG. 1.

FIGS. 4A and 4B illustrate examples for improving the efficiency ofoptical coupling of the opto-electric bus module according to anotherembodiment of the present invention.

In FIG. 4A, the opto-electric device 104 supplies a collected lightsource through a lens 307 included in the opto-electric interconnectionunit 300 to the optical waveguide 301, thereby providing high-efficiencyoptical coupling.

In FIG. 4B, the opto-electric interconnection unit 300 further includesthe lens 307 and a polarizer 308. For excitation of surface plasmonpolariton that theoretically describes optical transmission of a metaloptical waveguide, light in a transverse magnetic (TM) mode has to beincident.

If light generated by a light emitting device, e.g., a vertical cavitysurface emitting laser (VCSEL), does not has the TM mode or has only aTE mode, TE-mode light generated by the light emitting device isconverted into TM-mode light and thus the TM-mode light required forexcitation of the surface plasmon polariton of the optical waveguide canbe incident by using the polarizer 308.

FIG. 5 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention.

The opto-electric bus module illustrated in FIG. 5 includes allcomponents illustrated in and described with reference to FIGS. 2Athrough 3F. However, the electric interconnection is not formed in thefirst convex-shaped micro structure 106 formed on the optical bench 103of an opto-electric transmission/reception unit 100 or 200. In addition,the electric interconnection is not formed in the first concave-shapedmicro structure 303 of the opto-electric interconnection unit 300.

Thus, only vertical and horizontal optical alignments between theopto-electric device 104 and the optical waveguide 301 are completed bycoupling between the convex-shaped micro structure 106 on the opticalbench 103 and the concave-shaped micro structure 303 of theopto-electric interconnection unit 300. At this time, the concave-shapedmicro structure 303 of the opto-electric interconnection unit 300 andthe convex-shaped micro structure 106 formed on the optical bench 103may be formed in pyramid shape in order to be coupled with each other asillustrated in FIG. 2B.

FIGS. 6A through 6D illustrate the structure of an opto-electric busmodule according to another embodiment of the present invention.

Referring to FIG. 6A, the opto-electric transmission/reception unit 100or 200 includes the opto-electric drive 102 and the optical bench 103mounted on the PCB 101. In the optical bench 103, the opto-electricdevice 104 and the large concave 105 are formed. The opto-electricdevice 104 is a light emitting device or a light receiving device. Theoptical waveguide 301 is formed in the opto-electric interconnectionunit 300.

Referring to FIGS. 6B through 6D, the opto-electric interconnection unit300 is inserted into the large concave 105 of the optical bench 103,thereby completing optical alignment between the active region 110 ofthe opto-electric device 104 and the optical waveguide 301. At thistime, by adjusting the height and width of the opto-electricinterconnection unit 300, the precision of the optical alignment betweenthe active region 110 of the opto-electric device 104 and the opticalwaveguide 301 can be adjusted.

FIGS. 7A and 7B illustrate the structure of an opto-electric bus moduleaccording to another embodiment of the present invention.

The opto-electric bus module illustrated in FIGS. 7A and 7B include allcomponents illustrated in and described with reference to FIGS. 2Athrough 3F. However, the large concave 105 is not formed in the opticalbench 103 of the opto-electric transmission/reception unit 100 or 200.

The concave-shaped micro structure 305 formed in the opto-electricinterconnection unit 300 and the convex-shaped micro structure 111formed on the optical bench 103 are coupled with each other, therebycompleting automatic, horizontal and vertical optical alignments betweenthe opto-electric device 104 and the optical waveguide unit 301.

The electric interconnection 107 formed on the convex surface of theconvex-shaped micro structure 106 formed on the optical bench 103 andthe electric interconnection 302 formed on the concave surface of theconcave-shaped micro structure 303 of the opto-electric interconnectionunit 300 are automatically electric-coupled, thereby simultaneouslycompleting electric connection and optical coupling between theopto-electric interconnection unit 300 and the opto-electrictransmission unit 100. The principle of optical coupling and electriccoupling between the opto-electric interconnection unit 300 and theopto-electric transmission/reception unit 100 or 200 is as illustratedin FIG. 7B.

FIGS. 8A and 8B illustrate the structure of an opto-electric bus moduleaccording to another embodiment of the present invention.

The opto-electric bus module illustrated in FIGS. 8A and 8B includes allcomponents illustrated in and described with reference to FIGS. 2Athrough 3F. However, the large concave 105 is not formed in the opticalbench 103 of the opto-electric transmission/reception unit 100 or 200and a cross-section of the optical waveguide 301 of the opto-electricinterconnection unit 300 further includes a 45°-reflective mirror 309.This opto-electric bus module can be applied to the use of a VCSEL or aphoto diode (PD) which vertically emits or receives light.

The principle of optical coupling and electric coupling between theopto-electric interconnection unit 300 and the opto-electrictransmission/reception unit 100 or 200 is as illustrated in FIG. 8B.

FIGS. 9A and 9B illustrate examples for improving the efficiency ofoptical coupling of an opto-electric bus module according to anotherembodiment of the present invention.

In FIG. 9A, the opto-electric device 104 supplies a collected lightsource through the lens 307 included in the opto-electricinterconnection unit 300 to the optical waveguide 301, thereby providinghigh-efficiency optical coupling.

In FIG. 9B, the opto-electric interconnection unit 300 further includesthe lens 307 and the polarizer 308. For excitation of surface plasmonpolariton that theoretically describes optical transmission of a metaloptical waveguide, light in a TM mode has to be incident.

If light generated by a light emitting device, e.g., a VCSEL, does nothas the TM mode or has only a TE mode, TE-mode light generated by thelight emitting device is converted into TM-mode light and thus theTM-mode light required for excitation of the surface plasmon polaritonof the optical waveguide can be incident by using the polarizer 308.

FIG. 10 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention.

Referring to FIG. 10, the opto-electric interconnection unit 300includes the optical waveguide 301 inserted into the flexible polymerstructure 304, the electric interconnection 302, the firstconcave-shaped micro structure 303 where the electric interconnection302 is formed, and the second concave-shaped micro structure 305 wherethe electric interconnection 302 is not formed. An end of the electricinterconnection 302 is opened on the concave surface of the firstconcave-shaped micro structure 303.

The opto-electric transmission/reception unit 100 or 200 includes theopto-electric device drive 102 and the optical bench 103 mounted on thePCB 101. The opto-electric device 104 and the large concave 105 areformed in the optical bench 103, and the first convex-shaped microstructure 106 where the electric connection 107 is formed and the secondconvex-shaped micro structure 111 where the electric connection 107 isnot formed are formed in the large concave 105. An end of the electricinterconnection 107 extends to the upper surface of the firstconvex-shaped micro structure 106 formed on the optical bench 103. Theopto-electric device 104 is a light emitting device or a light receivingdevice and is located on an inclined wall surface of the large concave105. The inclination of the wall surface ranges between 0° and 90°.

Three types of electric interconnections, i.e., the electricinterconnection 107 for electric communication, the electricinterconnection 108 for an optical device, and the integrated electricinterconnection 109 are formed.

FIGS. 11A and 11B illustrate optical coupling and electric coupling ofthe opto-electric bus module according to another embodiment of thepresent invention.

In FIG. 11A, the opto-electric interconnection unit 300 and the opticalbench 103 of the opto-electric transmission/reception unit 100 or 200are opto-electrically coupled. As described with reference to FIGS. 2Athrough 2C, the concave-shaped micro structure 303 of the opto-electricinterconnection unit 300 is connected to the convex-shaped microstructure 106 on the optical bench 103, thereby simultaneouslycompleting optical alignment and electric connection.

As illustrated in and described with reference to FIGS. 3A through 3F,the first concave-shaped micro structure 303 is connected to the firstconvex-shaped micro structure 106 and the second concave-shaped microstructure 305 is connected to the second convex-shaped micro structure111.

Automatic, vertical and horizontal optical alignments between theopto-electric device 104 and the optical waveguide unit 301 arecompleted by coupling between the second concave-shaped micro structure305 formed in the opto-electric interconnection unit 300 and the secondconvex-shaped micro structure 111 formed on the optical bench 103 of theopto-electric transmission unit 100.

In addition, the electric interconnection 107 formed the convex surfaceof the convex-shaped micro structure 106 formed on the optical bench 103and the electric interconnection 302 formed on the concave surface ofthe concave-shaped micro structure 303 of the opto-electricinterconnection unit 300 are also automatically electric-connected toeach other, thereby simultaneously completing optical coupling andelectric connection between the opto-electric interconnection unit 300and the opto-electric transmission unit 100.

Referring to FIG. 11B, the concave-shaped micro structure 303 formed inthe opto-electric interconnection unit 300 is inserted into theconvex-shaped micro structure 106 formed on the optical bench 103 of theopto-electric transmission unit 100, thereby completing automatic,vertical and horizontal optical coupling between the active region 110of the opto-electric device 104 and the optical waveguide 301.

In addition, the electric interconnection 107 formed on theconvex-shaped micro structure 106 of the optical bench 103 and theelectric interconnection 302 formed on the concave surface of theconcave-shaped micro structure 303 of the opto-electric interconnectionunit 300 are automatically connected.

FIG. 12 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention.

Referring to FIG. 12, the optical waveguide 301 inserted into theflexible polymer structure 304, the electric interconnection 302, aconvex-shaped micro structure 331 (hereinafter, referred to as a firstconvex-shaped micro structure) where the electric interconnection 302 isformed, and a convex-shaped micro structure 332 (hereinafter, referredto as a second convex-shaped micro structure) where the electricinterconnection 302 is not formed. An end of the electricinterconnection 302 is opened on the upper surface of the firstconvex-shaped micro structure 331.

The opto-electric transmission/reception unit 100 or 200 includes theopto-electric device drive 102 and the optical bench 103 mounted on thePCB 101. In the optical bench 103, the opto-electric device 104, aconcave-shaped micro structure 131 (hereinafter, referred to as a firstconcave-shaped micro structure) where the electric interconnection 107is formed, and a concave-shaped micro structure 132 (hereinafter,referred to as a second concave-shaped micro structure) where theelectric interconnection 107 is not formed. An end of the electricinterconnection 107 extends to the concave surface of the firstconcave-shaped micro structure 131 of the optical bench 103. Theopto-electric device 104 is a light emitting device or a light receivingdevice.

Three types of electric interconnections, i.e., the electricinterconnection 107 for electric communication, an electricinterconnection 108 for an optical device, and an integrated electricinterconnection 109 are formed.

FIGS. 13A through 13D illustrate optical coupling and electric couplingof the opto-electric bus module according to another embodiment of thepresent invention.

Referring to FIG. 13A, the opto-electric interconnection unit 300includes the first convex-shaped micro structure 331 and the secondconvex-shaped micro structure 332, and the optical waveguide unit 301formed therebetween.

The optical bench 103 includes the first concave-shaped micro structure131 where the electric interconnection 107 is formed, and the secondconcave-shaped micro structure 132.

On the lower surface of the first concave-shaped micro structure 131,the electric interconnection 107 and a space 112 for insertion of theelectric interconnection 302 formed on the upper surface of the firstconvex-shaped micro structure 331 of the opto-electric interconnectionunit 300 may be provided together.

Referring to FIG. 13B, the first convex-shaped micro structure 331 isconnected to the first concave-shaped micro structure 131 and the secondconvex-shaped micro structure 332 is connected to the secondconcave-shaped micro structure 132.

The second convex-shaped micro structure 332 formed in the opto-electricinterconnection unit 300 and the second concave-shaped micro structure132 formed in the optical bench 103 of the opto-electrictransmission/reception unit 100 or 200 are coupled to each other,thereby completing automatic, horizontal and vertical optical alignmentsbetween the opto-electric device 104 and the optical waveguide unit 301.

In addition, the electric interconnection 107 formed on the concavesurface of the concave-shaped micro structure 131 formed on the opticalbench 103 and the electric interconnection 302 formed on the convexsurface of the convex-shaped micro structure 331 of the opto-electricinterconnection unit 300 are electric-connected automatically, therebysimultaneously completing optical coupling and electric connectionbetween the opto-electric interconnection unit 300 and the opto-electrictransmission unit 100.

At this time, the second convex-shaped micro structure 332 and thesecond concave-shaped micro structure 131 are used for vertical andhorizontal optical alignments between the optical waveguide unit 301 ofthe opto-electric interconnection unit 300 and the opto-electric device104.

By adjusting the heights of the second convex-shaped micro structure 332and the second concave-shaped micro structure 132, the height of theoptical waveguide 301 of the opto-electric interconnection unit 300placed on the optical bench 103 can be adjusted. Moreover, thehorizontal position of the optical waveguide 301 of the opto-electricinterconnection unit 300 placed on the optical bench 103 can be adjustedby adjusting the positions of the second concave-shaped micro structure132 and the second convex-shaped micro structure 332.

Coupling between the first convex-shaped micro structure 331 and thefirst concave-shaped micro structure 131 is used for electric connectionbetween the electric interconnection 302 formed on the convex surface ofthe first convex-shaped micro structure 331 and the electricinterconnection 107 formed on the concave surface of the firstconcave-shaped micro structure 131.

The electric interconnection 302 formed on the convex surface of thefirst convex-shaped micro structure 331 has some thickness. Thus, adesigned step between the optical waveguide unit 301 and theopto-electric device 104 may be changed during coupling between theopto-electric interconnection unit 300 and the optical bench 103. Toprevent such a change, the first concave-shaped micro structure 131includes the space 112 into which the electric interconnection 302 ofthe first convex-shaped micro structure 331 is inserted.

In other words, when the opto-electric interconnection unit 300 iscoupled to the optical bench 103, the space 112 accommodates theelectric interconnection 302, thereby maintaining the step between theoptical waveguide unit 301 and the opto-electric device 104, which isformed during coupling between the second concave-shaped micro structure132 and the second convex-shaped micro structure 331, constant and thuspreventing change of optical coupling efficiency.

FIG. 13C illustrates a horizontal cross-section where the opto-electricinterconnection unit 300 is opto-electric-coupled with the optical bench103 of the opto-electric transmission/reception unit 100 or 200. Like adescription made with reference to FIGS. 2A through 2C, theconvex-shaped micro structure 331 of the opto-electric interconnectionunit 300 is connected to the concave-shaped micro structure 131 of theoptical bench 103, thereby simultaneously completing optical alignmentand electric connection.

The first convex-shaped micro structure 331 is connected to the firstconcave-shaped micro structure 131 and the second convex-shaped microstructure 332 is connected to the second concave-shaped micro structure132.

The second convex-shaped micro structure 332 formed on the opto-electricinterconnection unit 300 and the second convex-shaped micro structure132 formed on the optical bench 103 of the opto-electrictransmission/reception unit 100 or 200 are coupled to each other bysliding, thereby completing automatic, vertical and horizontal opticalalignment between the opto-electric device 104 and the optical waveguideunit 301.

In addition, the electric interconnection 107 formed on the concavesurface of the concave-shaped micro structure 131 formed in the opticalbench 103 and the electric interconnection 302 formed on the convexsurface of the convex-shaped micro structure 331 of the opto-electricinterconnection unit 300 are automatically electric-coupled, therebysimultaneously completing electric connection and optical couplingbetween the opto-electric interconnection unit 300 and the opto-electrictransmission unit 100.

Referring to FIG. 13D, the convex-shaped micro structure 331 formed onthe opto-electric interconnection unit 300 is inserted into theconcave-shaped micro structure 131 of the optical bench 103 of theopto-electric transmission/reception unit 100 or 200, thereby completingautomatic, vertical and horizontal optical-couplings between the activeregion 110 of the opto-electric device 104 and the optical waveguideunit 301.

Moreover, the electric interconnection 107 formed on the concave surfaceof the concave-shaped micro structure 106 of the optical bench 103 andthe electric interconnection 302 formed on the convex surface of theconvex-shaped micro structure 331 of the opto-electric interconnectionunit 300 are automatically connected to each other.

Referring to FIG. 13E, the convex-shaped micro structure 331 or 332 ofthe opto-electric interconnection unit 300 and the concave-microstructure 131 or 132 of the optical bench 103 may be formed in pyramidshape in order to apply vertical flip-chip coupling to coupling betweenthe concave-shaped micro structure 131 or 132 and the concave-shapedmicro structure 331 or 332.

FIGS. 14A through 14C illustrate the structure of an opto-electric busmodule according to another embodiment of the present invention.

In FIG. 14A, the opto-electric bus module includes all componentsillustrated in and described with reference to FIGS. 12 and 13E.However, a cross-section of the optical waveguide 301 of theopto-electric interconnection unit 300 further includes the45°-reflective mirror 309. This opto-electric bus module can be appliedto the use of a VCSEL or a PD which vertically emits or receives light.

The principle of optical coupling and electric coupling between theopto-electric interconnection unit 300 and the opto-electrictransmission/reception unit 100 or 200 is as illustrated in FIGS. 14Band 14C and is the same as that described with reference to FIGS. 12through 13E.

FIGS. 15A through 15D illustrate examples for improving the efficiencyof optical coupling of the opto-electric bus module according to anotherembodiment of the present invention.

In FIG. 15A, the opto-electric device 104 supplies a collected lightsource through the lens 307 included in the opto-electricinterconnection unit 300 to the optical waveguide 301, therebyhigh-efficiency optical coupling.

In FIG. 15B, the opto-electric interconnection unit 300 further includesthe lens 307 and the polarizer 308. For excitation of surface plasmonpolariton that theoretically describes optical transmission of a metaloptical waveguide, light in a TM mode has to be incident.

If light generated by a light emitting device, e.g., a VCSEL, does nothas the TM mode or has only a TE mode, TE-mode light generated by thelight emitting device is converted into TM-mode light and thus theTM-mode light required for excitation of the surface plasmon polaritonof the optical waveguide can be incident by using the polarizer 308.

In FIG. 15C, the opto-electric device 104 supplies a collected lightsource by the 45°-reflective mirror 309 included in the opto-electricinterconnection unit 300 through the lens 307 to the optical waveguide301, thereby providing high-efficiency optical coupling.

In FIG. 15D, the opto-electric interconnection unit 300 further includesthe polarizer 308 in addition to the 45°-reflective mirror 309 and thelens 307. For excitation of surface plasmon polariton that theoreticallydescribes optical transmission of a metal optical waveguide, light in aTM mode has to be incident.

If light generated by a light emitting device, e.g., a VCSEL, does nothas the TM mode or has only a TE mode, TE-mode light generated by thelight emitting device is converted into TM-mode light and thus theTM-mode light required for excitation of the surface plasmon polaritonof the optical waveguide can be incident by using the polarizer 308.

FIG. 16 illustrates the structure of an opto-electric bus moduleaccording to another embodiment of the present invention.

Referring to FIG. 16, the opto-electric interconnection unit 300includes the optical waveguide 301 inserted into the flexible polymerstructure 304, the first convex-shaped micro structure 331 where theelectric interconnection 302 is formed, and the second convex-shapedmicro structure 332 where the electric interconnection 302 is notformed. An end of the electric interconnection 302 is opened on theupper surface of the first convex-shaped micro structure 331.

The opto-electric transmission/reception unit 100 or 200 includes afirst optical bench 103, the opto-electric device drive 102 formed onthe optical bench 103, and a second optical bench 116. The firstconcave-shaped micro structure 131 where the electric interconnection107 is formed and the second concave-shaped micro structure 132 areformed in the first optical bench 103. The opto-electric device 104 isformed on the second optical bench 116. An end of the electricinterconnection 107 extends to the lower surface of the firstconcave-shaped micro structure 131 of the first optical bench 103. Theopto-electric device 104 is a light emitting device or a light receivingdevice.

Three types of electric interconnections, i.e., the electricinterconnection 107 for electric communication, the electricinterconnection 108 for an optical device, and the integrated electricinterconnection 109 are formed.

FIGS. 17A and 17B illustrate optical coupling and electric coupling ofthe opto-electric bus module according to another embodiment of thepresent invention.

FIG. 17A illustrates a horizontal cross-section where the opto-electricinterconnection unit 300 and the optical bench 103 of the opto-electrictransmission/reception unit 100 or 200 are opto-electrically coupled toeach other. The first convex-shaped micro structure 331 of theopto-electric interconnection unit 300 is connected to the firstconcave-shaped micro structure 131 of the optical bench 103, therebysimultaneously completing optical alignment and electric connection.

The first convex-shaped micro structure 331 is connected to the firstconcave-shaped micro structure 131 and the second convex-shaped microstructure 332 is connected to the second concave-shaped micro structure132.

In addition, the optical bench 116 having the opto-electric device 104mounted thereon is inserted into a third concave-shaped micro structure115.

The second convex-shaped micro structure 332 formed on the opto-electricinterconnection unit 300 and the second concave-shaped micro structure132 formed in the optical bench 103 of the opto-electrictransmission/reception unit 100 or 200 are coupled to each other bysliding, thereby completing automatic, vertical and horizontal opticalalignments between the opto-electric device 104 and the opticalwaveguide unit 301.

In addition, the electric interconnection 107 formed on the concavesurface of the concave-shaped micro structure 131 formed in the opticalbench 103 and the electric interconnection 302 formed on the convexsurface of a portion of the convex-shaped micro structure 331 of theopto-electric interconnection unit 300 are electric-connectedautomatically, thereby simultaneously completing optical coupling andelectric connection between the opto-electric interconnection unit 300and the opto-electric transmission unit 100.

Referring to FIG. 17B, the convex-shaped micro structure 331 formed onthe opto-electric interconnection unit 300 is inserted into theconcave-shaped micro structure 131 formed in the optical bench 103 ofthe opto-electric transmission/reception unit 100 or 200, therebycompleting automatic, vertical and horizontal optical couplings betweenthe active region 110 of the opto-electric device 104 and the opticalwaveguide unit 301.

Moreover, the electric interconnection 107 formed on the concave surfaceof the concave-shaped micro structure 106 formed in the optical bench103 and the electric interconnection 302 formed on the convex surface ofthe convex-shaped micro structure 331 of the opto-electricinterconnection unit 300 are automatically connected to each other.

FIGS. 18A through 18C are diagrams for explaining the structure of anoptical waveguide and the principle of optical transmission used in anoptical waveguide unit of an opto-electric bus module according to anembodiment of the present invention.

As illustrated in FIG. 18A, a metal line is embedded within a dielectricsubstance 3. An optical waveguide 4 can transmit incident light up to adistance of several tens of centimeters by using the metal line whosewidth is several tens of microns. Such an optical waveguide using ametal line is called a metal optical waveguide. In the presentinvention, an optical waveguide may be a metal optical waveguide or maybe flexible. Optical transmission of the metal optical waveguide may bedescribed based on long-range surface plasmon polariton (LR_SPP) theory.

Briefly describing an optical waveguiding principle of the meta-lineoptical waveguide, an optical signal is delivered by polarizations offree electrons in the metal line and mutual coupling between thepolarizations.

Consecutive couplings between the free electrons are called surfaceplasmon polariton and long-range optical transmission using surfaceplasmon polariton is theoretically called long-range surface plasmonpolariton (LR-SPP).

A surface plasmon (SP) is a charge-density oscillating wave whichtravels along a boundary where real number terms of a dielectricconstant have opposite signs, and surface charge density oscillationforms a longitudinal surface bound wave.

The longitudinal surface bound wave is a component where anelectric-field component of an incident wave is vertical with respect tothe boundary. Only a TM mode can excite and waveguide long-range surfaceplasmon polariton.

Such a metal optical waveguide can sufficiently deliver an opticalsignal with a metal line of a fine size, e.g., a thickness of 5-200 nmand a width of 2-100 μm.

FIG. 18B illustrates a state where an optical signal is smoothlytransmitted by appropriate formation of polarizations of free electrons.FIG. 18C illustrates a state where an optical signal is not smoothlytransmitted by inappropriate formation of polarizations of freeelectrons.

In other words, when a TM mode Ex along an x-axis direction isasymmetric by means of polarizations of free electrons, opticaltransmission is smoothly performed.

In right sides of FIGS. 18B and 18C, the intensities of transmittedoptical signals are briefly expressed. It can be seen that the opticalsignal in FIG. 13B is transmitted more smoothly than the optical signalin FIG. 13C.

Dielectric constants ∈1 and ∈3 of dielectric substances on and under themetal line may be the same as or different from each other, and themetal optical waveguide may be formed by surrounding the metal line withthe same dielectric substance by using such a principle.

FIG. 19 illustrates a manually-connected opto-electric bus module and acommunication system providing opto-electric simultaneous communicationby using the manually-connected opto-electric bus module according to anembodiment of the present invention.

Referring to FIG. 19, an integrated electric signal (including anopto-electric signal and an electric communication signal) generated bya first semiconductor chip 501 of a first main board 500 is delivered toan integrated electric interconnection 109 of the opto-electrictransmission unit 100 of the opto-electric bus module through anelectric connector 502. The opto-electric signal of the integratedelectric signal of the integrated electric interconnection 109 isseparately delivered to the opto-electric device drive 102 and deliveredto the opto-electric device 104 through the electric interconnection108, thereby generating an optical signal. The generated optical signalis delivered to the opto-electric reception unit 200 through the opticalwaveguide 301 of the opto-electric interconnection unit 300. Inaddition, the electric communication signal of the integrated electricsignal of the integrated electric interconnection 109 is separatelyconnected to the electric interconnection 107 and delivered to theopto-electric reception unit 200 through the electric interconnection302 of the opto-electric interconnection unit 300.

FIGS. 20 and 21 are diagrams for explaining a method of manufacturing anopto-electric interconnection unit according to an embodiment of thepresent invention. In other words, FIG. 20 is a diagram for explaining amethod of manufacturing an opto-electric interconnection unit includinga concave-shaped micro structure and FIG. 21 is a diagram for explaininga method of manufacturing an opto-electric interconnection unitincluding a convex-shaped micro structure.

Referring to FIG. 20, ultraviolet (UV) hardened polymer is coated onto asubstrate and is hardened by UV rays in order to form a lower clad, andan optical waveguide and an electric interconnection are formed on thelower clad.

UV hardened polymer is coated onto the lower clad in order to form anupper clad, and UV transparent mold having a convex-shaped microstructure formed therein is pressed onto the upper clad and then UVhardening is performed. The mold is separated from the upper clad,thereby obtaining an opto-electric interconnection unit having aconcave-shaped micro structure where an electrode is formed.

Referring to FIG. 21, UV hardening polymer is coated onto a substrateand is hardened by UV rays in order to form a lower clad, and an opticalwaveguide is formed on the lower clad.

UV hardened polymer is coated onto the lower clad in order to form anupper clad, and UV transparent mold having a concave-shaped microstructure formed therein is pressed onto the upper clad and then UVhardening is performed. The mold is separated from the upper clad and anelectric interconnection is formed on the upper clad.

As such, the opto-electric bus module according to the present inventionprovides optical/electric simultaneous communication between boards andis used for optical/electric simultaneous communication between a boardand a chip or a chip and a chip.

The opto-electric bus module according to the present invention directlyincludes an optical device therein without using an additional opticalcomponent required for optical coupling between an opto-electric deviceand an optical waveguide, thereby providing a pluggable module capableof efficiently performing optical communication between semiconductorchips.

Moreover, the opto-electric bus module according to the presentinvention provides a way to simultaneously complete opticalcommunication and electric communication between semiconductor devicesby using electric interconnections included in the opto-electric busmodule.

Furthermore, the opto-electric bus module according to the presentinvention uses a metal optical waveguide using long-range surfaceplasmon polariton for an optical waveguide, thereby forming the opticalwaveguide having a thickness of several tens of microns or less and thussharply improving the thickness integration degree of the opto-electricbus module.

Therefore, according to the preset invention, optical communication andelectric communication between semiconductor chips can be completed atthe same time by using the opto-bus module which provides low-speedelectric communication while manually maintaining solid opticalcoupling.

The present invention can also be embodied as a computer-readable codeon a computer-readable recording medium.

Examples of the computer-readable recording medium include magneticrecording media such as read-only memory (ROM), random-access memory(RAM), floppy disks, and hard disks, optical data storage devices suchas CD-ROMs and digital versatile disks (DVDs), and carrier waves such astransmission over the Internet. The computer-readable recording mediumcan also be distributed over network of coupled computer systems so thatthe computer-readable code is stored and executed in a decentralizedfashion.

While the present invention has been particularly shown and describedwith reference to embodiments thereof, it will be understood by one ofordinary skill in the art that various changes in form and detail may bemade therein without departing from the spirit and scope of the presentinvention as defined by the following claims.

1. An opto-electric bus module comprising: an opto-electricinterconnection unit where an optical waveguide is formed and at leastone of a concave-shaped micro structure and a convex-shaped microstructure is formed on a lower surface of a structure into which atleast one first electric interconnection is inserted; and an opticalbench where a convex-shaped micro structure or a concave-shaped microstructure is formed in a position corresponding to the micro structureformed in the opto-electric interconnection unit, an opto-electricdevice for performing optical communication through the opticalwaveguide is mounted, and at least one second electric interconnectionfor electric connection to a semiconductor chip is formed.
 2. Theopto-electric bus module of claim 1, wherein the first electricinterconnection is exposed on at least one convex or concave surface ofthe micro structure formed in the opto-electric interconnection unit,and the second electric interconnection is formed on a convex or concavesurface of the micro structure of the optical bench in a positioncorresponding to the micro structure of the opto-electricinterconnection unit where the first electric interconnection isexposed, in order to complete electric connection between theopto-electric interconnection unit and the optical bench.
 3. Theopto-electric bus module of claim 1, wherein a concave-shaped microstructure and a convex-shaped micro structure comprising predeterminedposition and height and comprising no electric interconnection formedtherein are formed in corresponding positions of the opto-electricinterconnection unit and the optical bench in order to complete verticaland horizontal optical alignments between the opto-electric device andthe optical waveguide.
 4. The opto-electric bus module of claim 1,wherein the opto-electric device and the optical waveguide arebutt-coupled to each other.
 5. The opto-electric bus module of claim 1,wherein the concave-shaped micro structure and the convex-shaped microstructure are formed in square pole to contact edges of theopto-electric interconnection unit and the optical bench, such that theconcave-shaped micro structure slides with respect to the convex-shapedmicro structure.
 6. The opto-electric bus module of claim 1, wherein theoptical bench comprises: a first optical bench where the opto-electricdevice is mounted on a 90°-inclined surface; and a second optical benchwhere the convex-shaped micro structure or the concave-shaped microstructure is formed in the position corresponding to the micro structureformed in the opto-electric interconnection unit and a concave-shapedmicro structure into which the first optical bench is inserted isformed.
 7. The opto-electric bus module of claim 1, wherein theopto-electric device is a light emitting device or a light receivingdevice and the light emitting device is a vertical cavity surfaceemitting laser (VCSEL) that is a transverse magnetic (TM)-mode lightemitting device.
 8. The opto-electric bus module of claim 7, furthercomprising a 45° reflective mirror in an end portion of theopto-electric interconnection unit in order to improve the efficiency ofoptical coupling between the VCSEL and a metal optical waveguide.
 9. Theopto-electric bus module of claim 8, further comprising a polarizer foradjusting polarization characteristics of a vertical optical signalunder the 45° reflective mirror.
 10. The opto-electric bus module ofclaim 1, wherein the opto-electric device is a light emitting device ora light receiving device, and the light emitting device uses a laserdiode that is a transverse magnetic (TM)-mode light emitting device. 11.The opto-electric bus module of claim 10, wherein when the lightemitting device is a TE-mode light emitting device, a polarizer islocated between the TE-mode light emitting device and the opto-electricinterconnection unit in order to convert TE-mode light into TM-modelight.
 12. The opto-electric bus module of claim 1, wherein theconcave-shaped micro structure of the opto-electric interconnection unitwhere the first electric interconnection is formed comprises a space foraccommodating a thickness of the second interconnection line formed inthe convex-shaped micro structure of the optical bench corresponding tothe concave-shaped micro structure of the opto-electric interconnectionunit.
 13. The opto-electric bus module of claim 1, whereincross-sections of the concave-shaped micro structure and theconvex-shaped micro structure are formed in diamond shape in order toprevent horizontal and vertical movements during electric connectionbetween the opto-electric interconnection unit and the optical bench.14. The opto-electric bus module of claim 1, wherein the opto-electricinterconnection unit comprises a clad of two layers and a concavesurface of the concave-shaped micro structure of the opto-electricinterconnection unit contacts a surface where the two layers meet. 15.An opto-electric bus module comprising: an opto-electric interconnectionunit where an optical waveguide is formed and into which at least oneelectric interconnection is inserted; and an optical bench where a largeconcave into which a portion of a front end of the opto-electricinterconnection unit is inserted a predetermined depth is formed and anopto-electric device for performing optical communication through theoptical waveguide is mounted.
 16. An opto-electric communication systemcomprising: an opto-electric interconnection unit where an opticalwaveguide is formed and at least one of a concave-shaped micro structureand a convex-shaped micro structure is formed on a lower surface of astructure into which at least one first electric interconnection line isinserted; and an opto-electric transmission/reception unit comprising:an optical bench where a convex-shaped micro structure or aconcave-shaped micro structure is formed in a position corresponding tothe micro structure formed in the opto-electric interconnection unit, anopto-electric device for performing optical communication through theoptical waveguide is mounted; a second electric interconnection formedon the optical bench and electrically connected with the first electricinterconnection; and a semiconductor chip connected to both theopto-electric device and the second electric interconnection.
 17. Theopto-electric communication system of claim 16, wherein the firstelectric interconnection is exposed on at least one convex or concavesurface of the micro structure formed in the opto-electricinterconnection unit, and the second electric interconnection is formedon a convex or concave surface of the micro structure of the opticalbench in a position corresponding to the micro structure of theopto-electric interconnection unit where the first electricinterconnection is exposed, in order to complete electric connectionbetween the opto-electric interconnection unit and the optical bench.18. The opto-electric communication system of claim 16, wherein aconcave-shaped micro structure and a convex-shaped micro structurecomprising predetermined position and height and comprising no electricinterconnection formed therein are formed in corresponding positions ofthe opto-electric interconnection unit and the optical bench in order tocomplete vertical and horizontal optical alignments between theopto-electric device and the optical waveguide.
 19. A method ofmanufacturing an opto-electric interconnection unit, the methodcomprising: forming a lower clad by coating ultraviolet (UV) hardenedpolymer onto a substrate and hardening the substrate with UV rays, andforming an optical waveguide and an electric interconnection on theresulting upper clad; forming an upper clad by coating UV hardenedpolymer onto the lower clad, pressing an UV permeable mold having aconvex-shaped micro structure formed therein onto the upper clad, andhardening the resulting upper clad with UV rays; and separating the moldfrom the upper clad.
 20. A method of manufacturing an opto-electricinterconnection unit, the method comprising: forming a lower clad bycoating ultraviolet (UV) hardened polymer onto a substrate and hardeningthe substrate with UV rays, and forming an optical waveguide on theresulting upper clad; forming an upper clad by coating UV hardenedpolymer onto the lower clad, pressing an UV permeable mold having aconcave-shaped micro structure formed therein onto the upper clad, andhardening the resulting upper clad with UV rays; separating the moldfrom the upper clad; and forming an electric interconnection on theupper clad.